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US 2024/0096832 A1Published application
Connecting pillar
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsEun Dong Jin, LEE HYUNKYU, Kim Kyung Tae, Bae Sung Moon, Park Eun Kwang, Seong Taek Kim, Kim Jin-Gyu, CHU YONGCHEOL, OH HEEBONG
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Abstract
An aspect of the present invention provides a metal pillar in a columnar shape formed by cutting a metal wire to a predetermined length. The metal pillar has a burr length of 0.1 to 0.5 μm on the cutting surface and provide a connecting pillar that has a solder layer on at least one area of the outer surface of the metal pillar, which comprises Sn, Cu, and Ag.
Claims15
The connecting pillar comprises the following:
- a column-shaped metal pillar formed by cutting both ends of a metal wire to a specified length;
- and
- the metal pillar comprising a solder layer on at least one region of its outer surface, which comprises Sn, Cu, and Ag.
The manufacturing method for the connecting pillar comprises the following:
- melting process of melting by including additive elements in the molten solution of base metal;
- strand process of producing strands or slices performing rolling, pressing or stranding from the melt after the melting process;
- wire drawing process of drawing from the strands or slices into wire;
- heat treatment process of heating the drawn wire at a temperature ranging from 160 to 300° C.;
- and
- cutting process of cutting the metal wire into a predetermined length to make metal pillars having a diameter of 50 to 300 μm and a height of 60 to 3,000 μm;
- and
- solder layer forming process of forming a solder layer by electroplating a metal containing Sn on the surface of the metal pillar.
5 more elements
Dependencies are inferred from the claim text.