Sensor element and method for producing a sensor element
AssigneeTDK Electronics Co., Ltd.
InventorsJan Ihle, Thomas Bernert, Gerald Kloiber
Life of this patent
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Abstract
In an embodiment a sensor element includes at least one carrier layer having a top side and an underside, at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance and at least one top electrode configured for electrically contacting the functional layer from a top side of the functional layer, wherein the top electrode is arranged directly on the functional layer, wherein the top electrode forms the top side of the sensor element, and wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system.
Claims16
A sensor element comprising:
- at least one carrier layer having a top side and an underside;
- at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance;
- and
- at least one top electrode configured for electrically contacting the functional layer from a top side of the functional layer,
- wherein the top electrode is arranged directly on the functional layer,
- wherein the top electrode forms the top side of the sensor element, and
- wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system and is configured to measure a temperature.
A method for producing a sensor element, the method comprising:
- providing a carrier material for forming a carrier layer;
- forming at least one feedthrough, wherein the feedthrough completely penetrates through the carrier material;
- filling the at least one feedthrough with a metallic material;
- coating the carrier material with a sensor material for forming a functional layer;
- and
- singulating sensor elements.
Dependencies are inferred from the claim text.