Cmp polishing pad
OwnerBainian Qian, Donna M. Alden +3inventors
InventorsBainian Qian, Donna M. Alden, Matthew Cimoch, Nan-Rong Chiou, Sheng-Huan Tseng
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Abstract
A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.
Claims10
A polishing pad useful in chemical mechanical polishing having a polishing layer comprising:
- a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent;
- and chlorine-free microelements having a specific gravity of 0.05 to 0.1 distributed within the polymer matrix.
A polishing pad useful in chemical mechanical polishing having a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements distributed within the polymer matrix wherein the polishing layer has a chlorine content less than 0.01 wt % based on total weight of the polishing layer as determined by Combustion Ion Chromatography (CIC) as set out in ASTM D7359-18, wherein the chlorine-free microelements having a volume averaged particle size of 15 to 30 micrometers and an average shell wall thickness of 30 to 300 nanometers.
Dependencies are inferred from the claim text.