Heat sink for a semiconductor switching device, and semiconductor switching device
AssigneeSiemens Aktiengesellschaft
InventorWalter Apfelbacher
Life of this patent
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Abstract
A heat sink for a semiconductor switching device. The heat sink has a contact surface for producing planar contact with one or more elements of a power module of the semiconductor switching device that are to be cooled. The heat sink additionally has measures for positioning the power module on and fastening it to the heat sink in a preferred position, and a fastening plate with molded-on mountings for positioning and mounting the heat sink on a carrier device. The heat sink, including the contact surface and the fastening plate, is manufactured in one piece from electrically insulating, thermally conductive plastics material having a thermal conductivity of at least 2 W/(m·K).
Claims6
A heat sink for a semiconductor switching device, the heat sink comprising:
- a contact surface for producing planar contact with at least one element of a power module of the semiconductor switching device that is to be cooled;
- means for positioning the power module on and fastening it to the heat sink in a given position, said means configured to produce a snap connection between the power module and the heat sink;
- a fastening plate having a molded-on means for positioning and mounting the heat sink on a carrier device;
- and
- the heat sink, including said contact surface and said fastening plate, being manufactured in one piece from an electrically insulating, thermally conductive plastics material having a thermal conductivity of at least 2 W/(m·K).
Dependencies are inferred from the claim text.