Carrier Substrate

A method for forming a carrier for packaging a power device, comprising:

• providing a thermal conductive ceramic substrate with at least recess region in a first region;
• forming a patterned adhesion layer on the first region on a first surface of the substrate, a second region on the first surface of the substrate, and a third region on a second surface of the substrate, the second surface opposite to the first surface by sputtering, evaporating, or electroless plating;
• forming a heat dissipation layer patterned on the adhesion layer by plating;
• forming a conformal cover layer for enclosing the adhesion layer and the heat dissipation layer;
• forming a diffusion barrier layer on the first region of the conformal cover layer by sputtering, evaporating, or plating;
• and
• forming an eutectic bonding layer on the diffusion barrier layer.

A carrier for packaging a power device, comprising:

• a thermal conductive ceramic substrate with at least one recess region, wherein a thickness of said substrate matches thermal expansion of the power device;
• an adhesion layer patterned on a first region on a first surface of the substrate, a second region on the first surface of the substrate, and a third region on a second surface of the substrate, the second surface opposite to the first surface;
• a heat dissipation layer patterned on the adhesion layer;
• a cover layer for enclosing the adhesion layer and the heat dissipation layer;
• a diffusion barrier layer on the first region of the conformal cover layer;
• and
• an eutectic bonding layer on the diffusion barrier layer.