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US 2024/0082885 A1Published application
Substrate cleaning device and method of cleaning substrate
AssigneeEbara Corporation
InventorsFumitoshi Oikawa, Koichi Fukaya, Erina Baba, Shuichi Suemasa, Hisajiro Nakano
Life of this patent
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Abstract
A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.
Claims9
A method of cleaning a substrate comprising:
- rotating the substrate;
- discharging from the first cleaning solution supply nozzle, a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate;
- and
- swinging the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.
1 more element
A method of cleaning a substrate comprising:
- rotating the substrate;
- discharging from the first cleaning solution supply nozzle, a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate;
- cleaning the substrate by rotating a roll cleaning member placed at a position passing through a rotation center of the substrate while contacting the surface of the substrate;
- and
- swinging the first cleaning solution supply nozzle in a range narrower than a half-surface of the substrate while the roll cleaning member is cleaning the substrate.
2 more elements
Dependencies are inferred from the claim text.