Vacuum treatment apparatus and vacuum treatment method

A vacuum treatment apparatus, comprising:

• a wind-off roller that pays out a base material having a film deposition surface and a non-film deposition surface opposite to the film deposition surface;
• a wind roller configured to wind the base material;
• a main roller that is provided between the wind-off roller and the wind roller in a conveying direction in which the base material is conveyed, has an outer circumferential surface that is held in contact with the non-film deposition surface, and is configured to wind and convey the base material;
• a deposition source that faces the outer circumferential surface of the main roller that is held in contact with the non-film deposition surface;
• an auxiliary roller that is provided at least either between the wind-off roller and the main roller or between the wind roller and the main roller in the conveying direction, configured to guide conveyance of the base material and adjust a tensile force of the base material wound and conveyed by the main roller;
• a thermometer configured to measure a temperature of the base material wound and conveyed by the main roller;
• a power source configured to apply a bias potential to the main roller;
• a temperature control mechanism configured to adjust a temperature of the main roller;
• and
• a controller configured to control the auxiliary roller, the thermometer, the power source, and the temperature control mechanism, wherein
• the controller is configured to
• detect the temperature of the base material wound and conveyed by the main roller,
• start film deposition to form a film deposition material on the base material when the temperature of the base material is in a film deposition temperature range,
• adjust the temperature of the main roller so that the temperature of the base material falls within the threshold range and adjust an adhesion force between the main roller and the base material when the temperature of the base material is out of a threshold range after starting film deposition on the base material, and
• continue the film deposition of the film deposition material on the base material with the temperature of the base material in the film deposition temperature range.