Substrate liquid processing apparatus and substrate liquid processing method
AssigneeTokyo Electron Limited
InventorsMitsuaki Iwashita, Takeshi Nagao
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Abstract
A technique advantageous for shortening time required for electroless plating that is performed on a substrate is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution; and a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder.
Claims12
A substrate liquid processing apparatus, comprising:
- a substrate holder configured to hold a substrate;
- a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution;
- and
- a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder.
A substrate liquid processing method comprising:
- accelerating a plating reaction of an unused electroless plating solution, the accelerating of the plating reaction including activating the electroless plating solution with respect to the plating reaction and heating the electroless plating solution;
- and
- supplying the electroless plating solution to a substrate.
Dependencies are inferred from the claim text.