Electrodeposition dispersion and method for producing insulating film
AssigneeMitsubishi Materials Corporation
InventorsShintaro Iida, Kazuhiko Yamasaki
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Abstract
The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.
Claims6
An electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the electrodeposition dispersion comprising:
- water;
- a dispersion medium;
- and
- a solid component,
- wherein the solid component includes a polyimide-based resin and a fluorine-based resin,
- the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less,
- an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and
- a standard deviation of the particle diameter of the solid component is 250 nm or less.
Dependencies are inferred from the claim text.