Different material bonding apparatus and operation method thereof
AssigneeHl Klemove Corp.
InventorMinha LEE
Life of this patent
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Abstract
Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second layer, the second layer includes a plurality of penetration grooves formed to be recessed in the one surface contacting the first layer, and a melting point of the second layer is higher than a melting point of the first layer.
Claims20
A bonding apparatus comprising:
- a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other;
- and
- a heater configured to apply heat to the other surface of the second layer,
- wherein the second layer includes a plurality of penetration grooves formed to be recessed in the one surface of the second layer contacting the first layer, and
- a melting point of the second layer is higher than a melting point of the first layer.
An operation method of a bonding apparatus, comprising:
- bringing a first layer into contact with a second layer including one surface that is provided with a plurality of penetration grooves and contacts the first layer, wherein the first layer and the second layer have different melting points;
- applying, by a heater, heat to the other surface of the second layer that does not contact the first layer;
- transferring the heat received by the second layer to the first layer and melting the first layer;
- and
- cooling the melted first layer after the melted first layer penetrates into the penetration groove provided in the second layer.
Dependencies are inferred from the claim text.