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US 2024/0010952 A1Published application
Cleaning Compositions
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsJieying Jiao, Thomas Dory
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Abstract
This disclosure relates to compositions for cleaning post etching residues on a semiconductor substrate, as well as related cleaning methods.
Claims51
A cleaning method, comprising:
- treating a substrate with a cleaning composition to obtain a treated substrate, the cleaning composition comprising at least one redox agent, at least one chelating agent, at least one organic solvent, at least one alkanolamine, and water;
- and
- sonicating the treated substrate in the presence of a first rinse solvent to obtain a cleaned substrate.
A cleaning method, comprising:
- sonicating a substrate in the presence of a cleaning composition to obtain a cleaned substrate, the cleaning composition comprising at least one redox agent, at least one chelating agent, at least one organic solvent, at least one alkanolamine, and water.
A cleaning method, comprising:
- treating a substrate with a first cleaning composition comprising sulfuric acid and hydrogen peroxide to obtain a treated substrate;
- and
- treating the treated substrate with a second cleaning composition to obtain a cleaned substrate, the second cleaning composition comprising at least one redox agent, at least one chelating agent, at least one organic solvent, at least one alkanolamine, and water.
A cleaning composition, comprising:
- at least one redox agent;
- at least one chelating agent;
- at least one organic solvent;
- at least one alkanolamine comprising methyl diethanolamine;
- and
- water.
3 more elements
Dependencies are inferred from the claim text.