Curable composition, cured product, and adhesive
AssigneeDIC Corporation
InventorsRyosuke Ozawa, Hajime Suganuma, Takeshi Yamazaki
Life of this patent
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Abstract
Provided are a curable composition, a cured product thereof, and an adhesive. The curable composition contains a blocked isocyanate prepolymer (A) formed from a polyol compound (a1), a polyisocyanate compound (a2), and a blocking agent (a3) as essential raw materials, an epoxy resin (B), and a curing agent (C). The blocking agent (a3) contains a phenol compound having a hydrocarbon group having 12 or more carbon atoms. The curable composition has excellent adhesive properties and resistance to humidity and heat, and can be suitably used for an adhesive and the like.
Claims20
A curable composition comprising:
- a blocked isocyanate prepolymer (A) formed from a polyol compound (a1), a polyisocyanate compound (a2), and a blocking agent (a3) as essential raw materials;
- an epoxy resin (B);
- and
- a curing agent (C),
- the blocking agent (a3) containing a phenol compound having a hydrocarbon group having 12 or more carbon atoms.
Dependencies are inferred from the claim text.