Contact structures in rc-network components

A method of fabricating an RC-network component, the method comprising:

• forming a capacitor having a thin-film top electrode portion at a surface on a first side of a substrate;
• forming an insulating layer on the thin-film electrode portion of the capacitor;
• forming one or more bridging contacts traversing openings in the insulating layer;
• and
• forming a plate-shaped contact on the insulating layer;
• wherein the bridging contacts electrically connect the thin-film top electrode portion of the capacitor to the plate-shaped contact,
• wherein the RC-network component has first and second contacts, the first contact comprising said contact plate, and a series RC circuit is formed between the first and second contacts,
• the substrate is a low ohmic semiconductor substrate doped to make a contribution of no more than 5% to the resistance of the RC-network component,
• in the direction of a thickness of the thin-film top electrode portion of the capacitor, a length of the bridging contacts is sufficiently greater than the thickness of the thin-film top electrode portion that an equivalent series resistance of the capacitor is proportional to a sheet resistance of the thin-film top electrode portion divided by a number of the bridging contacts, and
• the openings in the insulating layer have an elongated peripheral shape having an aspect ratio equal to or greater than 1:1.