Methods and apparatus to adhere a dielectric to a nonconductive layer in circuit devices
AssigneeIntel Corporation
InventorsKristof Darmawikarta, Srinivas Pietambaram, Benjamin Duong, Haobo Chen
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Abstract
Methods, apparatus, systems, and articles of manufacture are disclosed that adhere a dielectric to a nonconductive layer in circuit devices. An example apparatus includes an electrically conductive layer, a dielectric layer, and an electrically nonconductive layer separating the dielectric layer from the conductive layer, the nonconductive layer having a first surface facing the conductive layer and a second surface facing the dielectric layer, the first surface having a first roughness, the second surface having a second roughness greater than the first roughness.
Claims24
An apparatus comprising:
- an electrically conductive layer;
- a dielectric layer;
- and
- an electrically nonconductive layer separating the dielectric layer from the conductive layer, the nonconductive layer having a first surface facing the conductive layer and a second surface facing the dielectric layer, the first surface having a first roughness, the second surface having a second roughness greater than the first roughness.
An integrated circuit (IC) package comprising:
- a substrate;
- a conductive trace extending along a first surface of the substrate;
- a dielectric material covering the conductive trace and extending across the first surface of the substrate;
- and
- a nonconductive material between the conductive trace and the dielectric material, the nonconductive material having a second surface facing away from the first surface of the substrate, the second surface of the nonconductive material including protrusions extending from a main body of the nonconductive material, the dielectric material to interface with sidewalls of the protrusions.
A method of manufacturing an integrated circuit (IC) package, the method comprising:
- depositing a nonconductive layer onto a conductive layer, the conductive layer to define a conductive trace within the IC package;
- etching recesses into the nonconductive layer to increase a roughness of an exposed surface of the nonconductive layer;
- and
- attaching a dielectric layer to the roughened surface of the nonconductive layer.
Dependencies are inferred from the claim text.