Semiconductor structure, packaging device and method for manufacturing semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorZongzheng LU
Life of this patent
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Abstract
A semiconductor structure includes: a substrate including a first surface; a first solder pad located on the first surface; a transferring part located on the first solder pad, in which the transferring part includes a first subpart covering the first solder pad and a second subpart covering the first subpart, and orthographic projections of the first subpart and the first solder pad on the first surface fall within an orthographic projection of the second subpart on the first surface; and a solder ball located on the second subpart.
Claims18
A semiconductor structure, comprising:
- a substrate comprising a first surface;
- a first solder pad located on the first surface;
- a transferring part located on the first solder pad, and comprising a first subpart covering the first solder pad and a second subpart covering the first subpart, wherein orthographic projections of the first subpart and the first solder pad on the first surface fall within an orthographic projection of the second subpart on the first surface;
- and
- a solder ball located on the second subpart.
A manufacturing method of a semiconductor structure, comprising:
- providing a substrate comprising a first surface;
- forming a first solder pad on the first surface;
- forming a transferring part on the first solder pad, the transferring part comprising a first subpart covering the first solder pad and a second subpart covering the first subpart, wherein orthographic projections of the first subpart and the first solder pad on the first surface fall within an orthographic projection of the second subpart on the first surface;
- and
- forming a solder ball on the second subpart.
Dependencies are inferred from the claim text.