Wiring circuit board
AssigneeNitto Denko Corporation
InventorsTakahiro IKEDA, Taketo ISHIKAWA, Yuki TAKEDA, Hironori KUWAYAMA, Kyotaro YAMADA
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AssigneeNitto Denko Corporation
InventorsTakahiro IKEDA, Taketo ISHIKAWA, Yuki TAKEDA, Hironori KUWAYAMA, Kyotaro YAMADA
Estimating the term…
A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.
A wiring circuit board comprising:
Dependencies are inferred from the claim text.