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US 2023/0422355 A1Published application
Heating structure and manufacturing method therefor
AssigneeTomoegawa Co., Ltd.
InventorsMaika KOKUI YAMAJI, Hideki MORIUCHI, Taku KURAHARA
Life of this patent
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Abstract
A heating structure includes: an object to be heated that has recesses on the surface thereof; a laminate-type heater that includes a heat-generating layer and a layer covering the same; and a filler that has flexibility and higher thermal conductivity than air, and is inserted into the recesses between the surface of the object and the surface of the laminate-type heater.
Claims8
A heating structure comprising:
- an object to be heated having recesses at its surface;
- a laminate type heater including a heat generation layer and one or more layers covering the heat generation layer;
- and
- a filler penetrating into the recesses between the surface of the object to be heated and a surface of the laminate type heater, and having flexibility and higher thermal conduction properties than air.
1 more element
Dependencies are inferred from the claim text.