Bonding device and bonding method
AssigneesSumitomo Electric Industries, Ltd., FOUR TECHNOS Co., Ltd.
InventorsMunetaka KUROKAWA, Naoki FUJIWARA, Takehiko KIKUCHI, Kazuo KASAYA, Takeshi MARUYAMA
Life of this patent
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Abstract
A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.
Claims13
A bonding device comprising:
- an irradiator that irradiates a surface of a first component with ultraviolet rays;
- and
- a conveyor that conveys the first component;
- wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and
- the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.
Dependencies are inferred from the claim text.