Semiconductor light-emitting device
AssigneeRohm Co., Ltd.
InventorMasahiko KOBAYAKAWA
Life of this patent
Estimating the term…
Abstract
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
Claims13
1-2. (canceled)
A semiconductor device comprising:
- a first lead frame including a bonding portion;
- a second lead frame spaced apart from the first lead frame in a first direction perpendicular to a thickness direction of the bonding portion;
- a semiconductor element mounted on an obverse surface of the bonding portion and electrically connected to the first lead frame and the second lead frame;
- and
- a case covering a part of the first lead frame and a part of the second lead frame,
- wherein the bonding portion includes a first exposed surface that is opposite from the obverse surface and exposed from the case,
- the first lead frame further includes at least one thin extension and at least one thick extension, the thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, the thin extension being smaller in thickness than the bonding portion, the thick extension extending from the bonding portion in the second direction,
- the thick extension is disposed next to the thin extension and has a same thickness as the bonding portion, the thick extension including a second exposed surface that is exposed from the case, and
- the second exposed surface of the thick extension and the first exposed surface of the bonding portion are contained in a same flat plane.
A semiconductor device comprising:
- a first lead frame including a bonding portion;
- a second lead frame spaced apart from the first lead frame in a first direction perpendicular to a thickness direction of the bonding portion;
- a semiconductor element mounted on an obverse surface of the bonding portion and electrically connected to the first lead frame and the second lead frame;
- and
- a case covering a part of the first lead frame and a part of the second lead frame,
- wherein the bonding portion includes a first exposed surface that is opposite from the obverse surface and exposed from the case,
- the first lead frame further includes at least one thin extension and at least one thick extension, the thin extension extending from the bonding portion in a second direction perpendicular to the thickness direction and the first direction, the thin extension being smaller in thickness than the bonding portion, the thick extension extending from the bonding portion in the second direction,
- the thick extension has a same thickness as the bonding portion and includes a second exposed surface that is exposed from the case,
- the thick extension and the thin extension are disposed next to and spaced apart from each other in the first direction, and
- the second exposed surface of the thick extension and the first exposed surface of the bonding portion are contained in a same flat plane.
Dependencies are inferred from the claim text.