Semiconductor structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorKa-Hing FUNG
Life of this patent
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Abstract
A semiconductor structure is provided. The semiconductor structure includes a plurality of nanostructures vertically stacked and separated from one another, a source/drain feature adjacent to the plurality of nanostructures, and an inner spacer layer. The inner spacer layer includes a vertical portion interposing between the plurality of nanostructures and the source/drain feature and a plurality of horizontal portions interposing between the nanostructures. A source/drain junction is located in the vertical portion of the inner spacer layer and is spaced apart from the plurality of nanostructures by a distance.
Claims20
A semiconductor structure, comprising:
- a plurality of nanostructures vertically stacked and separated from one another;
- a source/drain feature adjacent to the plurality of nanostructures;
- and
- an inner spacer layer including a vertical portion interposing between the plurality of nanostructures and the source/drain feature and a plurality of horizontal portions interposing between the nanostructures, wherein a source/drain junction is located in the vertical portion of the inner spacer layer and is spaced apart from the plurality of nanostructures by a distance.
A semiconductor structure, comprising:
- a gate stack wrapping around a plurality of nanostructures;
- a gate spacer layer alongside the gate stack;
- a semiconductor inner spacer layer alongside plurality of nanostructures below the gate spacer layer;
- and
- a source/drain feature alongside the semiconductor inner spacer layer, wherein a source/drain junction vertically extends in the semiconductor inner spacer and between extension lines of sidewalls of the gate spacer layer.
A method for forming a semiconductor structure, comprising:
- forming a fin structure in which first semiconductor layers and second semiconductor layers are stacked alternatingly;
- etching the fin structure to form a recess;
- recessing the first semiconductor layers to form notches between the second semiconductor layers;
- forming an inner spacer layer to cover sidewalls of the second semiconductor layers and fill the notches;
- forming a source/drain feature in the source/drain recess;
- and
- driving a dopant from the source/drain feature into the inner spacer layer to form a source/drain junction, wherein the source/drain junction vertically extends through a portion of the inner spacer layer covering the sidewalls of the second semiconductor layers.
Dependencies are inferred from the claim text.