Manufacturing method of image sensor package

A method of manufacturing an image sensor package, the method comprising:

• preparing a device wafer to which a first wafer including a plurality of image sensor chip portions and a first scribe lane portion surrounding the plurality of image sensor chip portions and a second wafer including a plurality of logic chip portions and a second scribe lane portion surrounding the plurality of logic chip portions are bonded;
• forming a preliminary dam pattern covering the first scribe lane portion and a portion of an upper surface of the first wafer adjacent to the first scribe lane portion;
• positioning a preliminary transparent substrate on the upper surface of the first wafer on which the preliminary dam pattern is formed;
• adhering the preliminary dam pattern to the device wafer and the preliminary transparent substrate by performing a laser bonding process of radiating a laser beam to the preliminary dam pattern;
• and
• performing a singulation process forming individual image sensor packages each of which including a transparent substrate, a dam, and an image sensor chip portion and a logic chip portion by cutting the preliminary transparent substrate, the preliminary dam pattern, and the device wafer.

A method of manufacturing an image sensor package, the method including:

• preparing a device wafer by bonding a first wafer and a second wafer together, the first wafer including a plurality of image sensor chip portions on which color filter arrays and micro lens arrays are sequentially disposed, and a first scribe lane portion surrounding each of the plurality of image sensor chip portions, the second wafer including a plurality of logic chip portions including a plurality of through electrodes, respectively, and a second scribe lane portion surrounding the plurality of logic chip portions;
• forming a preliminary dam pattern covering the first scribe lane portion and a portion of an upper surface of the first wafer adjacent to the first scribe lane portion, but not covering the color filter arrays and the micro lens arrays;
• positioning a preliminary transparent substrate on the upper surface of the first wafer on which the preliminary dam pattern is formed;
• adhering the preliminary dam pattern to the device wafer and the preliminary transparent substrate by performing a laser bonding process of radiating a laser beam to the preliminary dam pattern;
• and
• performing a singulation process forming individual image sensor packages each of which including a transparent substrate, a dam, an image sensor chip portion, and a logic chip portion by cutting the preliminary transparent substrate, the preliminary dam pattern, the first scribe lane portion, and the second scribe lane portion.