Semiconductor packaging

A structure, comprising:

• a substrate comprising a first redistribution layer (RDL) and a first ball grid array (BGA);
• an input/output (I/O) connection disposed on and electrically coupled to the first RDL;
• a second RDL disposed on and electrically coupled to the I/O connection;
• a system-on-a-chip (SOC) disposed on and electrically coupled to the second RDL;
• a joint section comprising:
• an adhesion layer in contact with the SOC;
• a first joint pad in contact with the adhesion layer;
• and
• a die attach film (DAF) disposed on the SOC and covering end portions of the adhesion layer and the first joint pad;
• and
• a second BGA attached to the first joint pad and a second joint pad of a semiconductor package.

A method, comprising:

• forming an adhesion layer in contact with a first semiconductor package;
• forming a first joint pad in contact with the adhesion layer;
• forming a film layer on the first semiconductor package and the first joint pad, comprising:
• forming a slanted sidewall of the film layer;
• covering an end portion of the adhesion layer and a first portion of the first joint pad;
• and
• exposing a second portion of the first joint pad;
• and
• forming a ball grid array (BGA) between the second portion of the first joint pad and a second joint pad of a second semiconductor package.