Light-emitting substrate, manufacturing method thereof, and display device
AssigneeShenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorPeihai WEI
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Abstract
A light-emitting substrate, a manufacturing method thereof, and a display device are provided. The light-emitting substrate includes a driving circuit layer, a light-emitting diode (LED) chip, an encapsulation layer, and a cover plate. The driving circuit layer includes a binding electrode. A connection electrode of the LED chip is connected to the binding electrode. The encapsulation layer is disposed on a side of the LED chip away from the driving circuit layer. The encapsulation layer covers the LED chip and the driving circuit layer. The cover plate is disposed on a side of the encapsulation layer away from the LED chip. A surface of the cover plate away from the encapsulation layer is a light-emitting surface of the light-emitting substrate.
Claims20
A light-emitting substrate, comprising:
- a driving circuit layer comprising a binding electrode;
- a light-emitting diode (LED) chip comprising a connection electrode, wherein the connection electrode is connected to the binding electrode;
- an encapsulation layer disposed on a side of the LED chip away from the driving circuit layer, wherein the encapsulation layer covers the LED chip and the driving circuit layer;
- and
- a cover plate disposed on a side of the encapsulation layer away from the LED chip, wherein a surface of the cover plate away from the encapsulation layer is a light-emitting surface of the light-emitting substrate.
A manufacturing method of a light-emitting substrate, comprising:
- providing a rigid substrate;
- sequentially forming a substrate and a driving circuit layer on the rigid substrate, wherein the driving circuit layer comprises a binding electrode and a bonding pad;
- providing a plurality of light-emitting diode (LED) chips, wherein a connection electrode of one of the LED chips is correspondingly bound and connected to the binding electrode;
- sequentially forming an encapsulation layer and a cover plate on a side of the LED chips away from the rigid substrate;
- and
- removing the rigid substrate.
Dependencies are inferred from the claim text.