Led package device and preparation method thereof, and display device

A preparation method of a light-emitting diode (LED) package device, applied to preparation of a LED package device, wherein the LED package device comprises a transparent substrate, a black layer, a transparent bonding layer, a plurality of LED chips, and a mold protective layer, wherein the plurality of LED chips are fixed to the transparent substrate based on the transparent bonding layer;

• the black layer is configured to cover the transparent bonding layer, the black layer is provided with a plurality of matching holes, and the plurality of LED chips are matched in the plurality of matching holes in a one-to-one correspondence;
• cover area of the transparent bonding layer is S1, area of a top surface of the transparent substrate is S2, and a constraint relationship between S1 and S2 is S1<S2;
• and the mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the plurality of LED chips on the transparent substrate;
• and
• wherein the method comprises:
• bonding the plurality of LED chips to a temporary carrier plate;
• covering the transparent bonding layer on the transparent substrate, and forming the black layer with the plurality of matching holes on the transparent bonding layer;
• patterning the transparent bonding layer and the black layer to expose part of a top surface of the transparent substrate;
• transferring the plurality of LED chips on the temporary carrier plate to the plurality of matching holes in the one-to-one correspondence so that the plurality of LED chips are bonded to the transparent bonding layer exposed in the plurality of matching holes;
• successively forming a planar layer, a wiring layer, and device electrodes on the black layer;
• and
• forming the mold protective layer on the transparent substrate to complete the preparation of the LED package device.

A display device, comprising:

• a carrier plate and a plurality of display modules arrayed on the carrier plate, wherein
• a display module of the plurality of display modules comprises a circuit board, wherein the circuit board is provided with a plurality of LED package devices, wherein a LED package device of the plurality of LED package devices comprises a transparent substrate, a black layer, a transparent bonding layer, a plurality of LED chips, and a mold protective layer, wherein the plurality of LED chips are fixed to the transparent substrate based on the transparent bonding layer;
• the black layer is configured to cover the transparent bonding layer, the black layer is provided with a plurality of matching holes, and the plurality of LED chips are matched in the plurality of matching holes in a one-to-one correspondence;
• cover area of the transparent bonding layer is S1, area of a top surface of the transparent substrate is S2, and a constraint relationship between S1 and S2 is S1<S2;
• and the mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the plurality of LED chips on the transparent substrate.