Electronic devices
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChun-Yen TING, Pao-Nan LEE, Jung Jui KANG, Chang Chi LEE
Life of this patent
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Abstract
An electronic device is provided. The electronic device includes a first die and a second die. The second die is disposed over the first die. A backside surface of the second die faces a backside surface of the first die. An active surface of the second die is configured to receive a first power. The second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.
Claims20
An electronic device, comprising:
- a first die;
- and
- a second die disposed over the first die and having a backside surface facing a backside surface of the first die,
- wherein an active surface of the second die is configured to receive a first power, the second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.
An electronic device, comprising:
- a first die;
- and
- a second die disposed over the first die,
- wherein the first die is configured to receive a first power and a second power, the first power is transmitted from the second die, the second power is free from passing through the second die, and the first power is different from the second power.
An electronic device, comprising:
- a first substrate;
- a first electronic component disposed over the first substrate and having a backside surface;
- and
- a second electronic component disposed over the backside surface of the first electronic component, wherein the second electronic component has a backside surface facing the backside surface of the first electronic component,
- wherein the first electronic component is configured to receive a first power passing through the backside surface of the first electronic component and a second power different from the first power.
Dependencies are inferred from the claim text.