Semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Chi LEE, Jyan-Ann HSIA
Life of this patent
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Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.
Claims20
A semiconductor package structure, comprising:
- a first electronic component;
- a second electronic component disposed above the first electronic component;
- a third electronic component spaced apart from the first electronic component;
- a fourth electronic component disposed above the third electronic component;
- and
- a connection element electrically connecting the second electronic component to the fourth electronic component,
- wherein the connection element is configured to adjust bandwidths of a plurality of transmission paths between the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component.
A semiconductor package structure, comprising:
- a first electronic component;
- a second electronic component comprising a first I/O module and disposed above the first electronic component;
- a third electronic component spaced apart from the first electronic component;
- and
- a connection element electrically connected to the second electronic component,
- wherein the first I/O module of the second electronic component comprises a controller configured to control data transmission between the second electronic component and the connection element.
A semiconductor package structure, comprising:
- a first electronic component;
- a second electronic component spaced apart from the first electronic component;
- and
- a connection element electrically connecting the first electronic component to the second electronic component,
- wherein the connection element comprises a first bridging element and a connective element configured to transmit data at least in a first direction;
- and
- wherein the connection element comprises a second bridging element electrically connected to the first bridging element through the connective element, and the second bridging element is configured to transmit data in a second direction different from the first direction.
Dependencies are inferred from the claim text.