Microelectronic assemblies including solder and non-solder interconnects
AssigneeIntel Corporation
InventorsAlois Nitsch, Han-Wen Lin, Yin-Ying Chen, Meng-Chi Lee, Andreas Dost, Hans Gerard Jetten
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Abstract
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface; a redistribution layer (RDL) having a surface, wherein the first surface of the first die is on and electrically coupled to the surface of the RDL by non-solder interconnects; and a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by solder interconnects.
Claims20
A microelectronic assembly, comprising:
- a first die, having a first surface and an opposing second surface;
- a redistribution layer (RDL) having a surface, wherein the first surface of the first die is on and electrically coupled to the surface of the RDL by non-solder interconnects;
- and
- a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by solder interconnects.
A microelectronic assembly, comprising:
- a redistribution layer (RDL) having a surface;
- a first die, having a first surface and an opposing second surface, wherein the first surface of the first die electrically coupled to the surface of the RDL by non-solder interconnects;
- a second die at the second surface of the first die, wherein the second die is electrically coupled directly to the second surface of the first die by first solder interconnects;
- and
- a third die at the second surface of the first die, wherein the third die is electrically coupled directly to the second surface of the first die by second solder interconnects.
A microelectronic assembly, comprising:
- a redistribution layer (RDL), having a first surface with first conductive contacts and an opposing second surface with second conductive contacts:
- a first die, having a first surface with third conductive contacts and an opposing second surface with fourth conductive contacts;
- wherein the third conductive contacts on the first die are electrically coupled to the second conductive contacts on the RDL by non-solder interconnects;
- a second die having a surface with fifth conductive contacts, wherein the fifth conductive contacts on the second die are electrically coupled to the fourth conductive contacts on the first die by solder interconnects;
- and
- an insulating material extending from the surface of the RDL, around the first die, around the solder interconnects, and at least partially around the second die, wherein the insulating material is continuous.
Dependencies are inferred from the claim text.