US 2023/0420399 A1 · BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE

Abstract

A bonded structure can include a first reconstituted element comprising a first element and having a first side comprising a first bonding surface and a second side opposite the first side. The first reconstituted element can comprise a first protective material disposed about a first sidewall surface of the first element. The bonded structure can comprise a second reconstituted element comprising a second element and having a first side comprising a second bonding surface and a second side opposite the first side. The first reconstituted element can comprise a second protective material disposed about a second sidewall surface of the second element. The second bonding surface of the first side of the second reconstituted element can be directly bonded to the first bonding surface of the first side of the first reconstituted element without an intervening adhesive along a bonding interface.

Claims29

Dependent claims

A method comprising:

providing a carrier wafer having an upper surface;
directly bonding lower surfaces of a plurality of elements to the upper surface of the carrier wafer without an intervening adhesive, each of the plurality of elements further comprising side surfaces;
applying an inorganic material along the side surfaces of the plurality of elements and over the upper surface of the carrier wafer to form a reconstituted wafer;
forming a bonding surface at an upper surface of the reconstituted wafer, wherein the bonding surface comprises a first nonconductive region and a first conductive region;
and
directly bonding a second wafer to the reconstituted wafer such that a second nonconductive region on the second wafer is directly bonded to the first nonconductive region of the reconstituted wafer and a second conductive region on the second wafer is directly bonded to the first conductive region of the reconstituted wafer.

3 more elements

Dependencies are inferred from the claim text.

Bonded structures without intervening adhesive

Life of this patent

Bonded structures without intervening adhesive

Life of this patent

Abstract

Claims29