Semiconductor package having smart power stage and e-fuse solution
AssigneeAlpha and Omega Semiconductor International LP
InventorPrabal Upadhyaya
Life of this patent
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Abstract
A semiconductor package comprises a lead frame, a low side metal-oxide-semiconductor field-effect transistor (MOSFET), an E-fuse MOSFET, a high side MOSFET, a metal connection, a gate driver, an E-fuse IC, and a molding encapsulation. A buck converter comprises a smart power stage (SPS) network and an E-fuse solution network. The SPS network comprises a high side switch, a low side switch, and a gate driver. A drain of the low side switch is coupled to a source of the high side switch via a switch node. The gate driver is coupled to a gate of the high side switch and a gate of the low side switch. The E-fuse solution network comprises a sense resistor, an E-fuse switch, an E-fuse integrated circuit (IC), and an SD circuit.
Claims9
A buck converter comprising
- a smart power stage (SPS) network comprising
- a high side switch;
- a low side switch, a drain of the low side switch being coupled to a source of the high side switch via a switch node;
- and
- a gate driver coupled to a gate of the high side switch and a gate of the low side switch;
- and
- an E-fuse solution network comprising
- an E-fuse switch, a source of the E-fuse switch coupled to a drain of the high side switch;
- an E-fuse integrated circuit (IC) comprising
- a comparator comprising
- a reference input;
- a functional input coupled to a short detection (SD) node;
- and
- an output;
- and
- an SD circuit coupled to the SD node of the E-fuse IC, the SD circuit comprising
- a first circuit resistor, a first node of the first circuit resistor being coupled to the switch node;
- a second circuit resistor;
- a circuit capacitor;
- and
- a circuit diode.
Dependencies are inferred from the claim text.