Electrically conductive strips on a side of a memory module
AssigneeIntel Corporation
InventorsMin Suet LIM, Kavitha NAGARAJAN, Eng Huat GOH, Telesphor KAMGAING
Life of this patent
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Abstract
Embodiments herein relate to systems, apparatuses, or processes for creating packages that include one or more memory modules with electrically conductive strips on the side of the memory module to route power or provide a ground to multiple BGA contacts on a side of the memory module coupled with a substrate. Providing power and/or ground in this manner enables fewer layers to be used in a substrate that are no longer needed to be routed in the power plane on the substrate, thus reducing a Z-height of the package. Other embodiments may be described and/or claimed.
Claims25
An apparatus comprising:
- a memory module with a top and a bottom opposite the top;
- and
- an electrically conductive strip on a side of the memory module and at least partially surrounding the memory module, the electrically conductive strip between the top and the bottom, wherein the electrically conductive strip is associated with a power or a ground of the memory module.
A package comprising:
- a substrate;
- a memory module with a top and a bottom opposite the top, wherein the memory module includes one or more electrical connections, and wherein the one or more electrical connections are electrically coupled with the substrate;
- and
- an electrically conductive strip on a side of the memory module, the electrically conductive strip between the top and the bottom, wherein the electrically conductive strip is electrically coupled with the one or more electrical connections.
A method comprising:
- providing a memory module that includes a plurality of electrical connections on a bottom of the memory module;
- forming an electrically conductive strip around at least a portion of a side of the memory module;
- and
- electrically and physically coupling the bottom of the memory module to a substrate, wherein the substrate includes a power source or a ground that electrically couples with the electrically conductive strip, and wherein the substrate includes a plurality of couplings that electrically couple the electrically conductive strip to the plurality of electrical connections on the bottom of the memory module.
Dependencies are inferred from the claim text.