Power module for half-bridge circuit with scalable architecture and improved layout

A method, comprising:

• electrically coupling a first conduction pad of a first electronic power device to a first clip coupled to a support having a first contact area and a second contact area;
• electrically coupling a second conduction pad of the first electronic device to a second clip coupled to the support;
• coupling a control pad of the first electronic device to the first control contact area;
• electrically coupling a first conduction pad of a second electronic power device to the second clip;
• electrically coupling a second conduction pad of the second electronic device to a third clip coupled to the support;
• and
• coupling a control pad of the second electronic device to the second control contact area, wherein the first and the second electronic power devices forming a half-bridge circuit.

A power module, comprising:

• a support including a first clip, a second clip, a third clip, a first, a first contact area, and a second contact area;
• and
• a half bridge circuit including:
• a first electronic device having a first conduction pad coupled to the first clip, a second conduction pad electrically coupled to the second clip, and a control pad coupled to the first control contact area;
• and
• a second electronic device having a first conduction pad electrically coupled to the second clip, a second conduction pad electrically coupled to a third clip, and a control pad of the second electronic device coupled to the second control contact area.