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US 2023/0420337 A1Published application
Cooling Cover and Packaged Semiconductor Device Including the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Jung Wu, Sheng-Tsung Hsiao, Jen Yu Wang, Tung-Liang Shao, Chih-Hang Tung
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Abstract
Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.
Claims20
A cooling cover for a semiconductor device comprising:
- an inlet;
- an outlet;
- and
- a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.
1 more element
An apparatus comprising:
- a packaged semiconductor device, the packaged semiconductor device comprising a first integrated circuit chip, the first integrated circuit chip comprising a plurality of channels on a backside of the first integrated circuit chip;
- and
- a cooling cover on the packaged semiconductor device, wherein the cooling cover comprises:
- a cooling chamber on the first integrated circuit chip;
- and
- a gasket surrounding the cooling chamber and contacting the packaged semiconductor device.
3 more elements
A method of cooling a packaged semiconductor device comprising:
- providing a packaged semiconductor device;
- attaching a cooling cover to the packaged semiconductor device;
- and
- flowing a liquid coolant through the cooling cover, wherein the cooling cover is configured to increase a flowrate of the liquid coolant as the liquid coolant moves across a surface of the packaged semiconductor device.
1 more element
Dependencies are inferred from the claim text.