Fan-out type semiconductor package and method of manufacturing the same

A fan-out type semiconductor package comprising:

• a package substrate;
• an interposer on an upper surface of the package substrate, the interposer comprising upper pads and lower pads electrically connected with the upper pads;
• conductive bumps between the package substrate and the lower pads of the interposer and electrically connecting the package substrate with the interposer;
• a semiconductor chip on a central portion of an upper surface of the interposer and electrically connected with the upper pads of the interposer, the semiconductor chip having a width narrower than a width of the interposer;
• a molding member on an edge portion of the upper surface of the interposer such as to surround side surfaces of the semiconductor chip, the molding member comprising an upper surface coplanar with an upper surface of the semiconductor chip;
• and
• a pillar structure in the molding member, the pillar structure comprising a material having a thermal conductivity higher than a thermal conductivity of the molding member.

A method of manufacturing a fan-out type semiconductor package, the method comprising:

• bonding a semiconductor chip to a central portion of an upper surface of an interposer;
• forming a molding member on an edge portion of the upper surface of the interposer such that the molding member surrounds the semiconductor chip;
• forming openings that extend vertically through the molding member;
• filling the openings with a material, which has a thermal conductivity higher than a thermal conductivity of the molding member, to form a pillar structure;
• arranging conductive bumps between the interposer and an upper surface of a package substrate;
• and
• thermally compressing an upper surface of the molding member using a bond tool for applying heat to the conductive bumps through the pillar structure to bond the interposer to the package substrate.