Chip package with pass through heat spreader
AssigneeXilinx, Inc.
InventorsGamal REFAI-AHMED, Suresh RAMALINGAM
Life of this patent
Estimating the term…
Abstract
Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to the cover. Another one or more other IC devices have a heat transfer path to the cover through the heat spreader. The separate heat transfer paths allow more effective thermal management of the IC devices of the chip package.
Claims21
A chip package comprising:
- a substrate;
- a first integrated circuit (IC) device mounted on the substrate;
- a second IC device mounted on the substrate;
- a heat spreader disposed over the first IC device, the heat spreader having an opening;
- and
- a cover disposed over the heat spreader, the cover having a protrusion extending through the opening in the heat spreader;
- the protrusion disposed over the second IC device.
A chip package comprising:
- a package substrate;
- a plurality of integrated circuit (IC) devices mounted on the package substrate, the plurality of IC devices comprising a first IC device, a second IC device and a third IC device, the first and second IC devices each generating, when in use, more heat than each of the other IC devices of the plurality of IC devices;
- a heat spreader disposed over the first IC device, the heat spreader having an opening, the first IC device and the third IC device having direct heat transfer paths to the heat spreader;
- and
- a cover disposed over the heat spreader, the cover having a protrusion extending through the opening in the heat spreader;
- the second IC device having a direct heat transfer path to the protrusion.
An electronic device comprising:
- a printed circuit board (PCB);
- a package substrate mechanically and electrically coupled to the PCB;
- a plurality of integrated circuit (IC) devices mechanically and electrically coupled to the package substrate, the plurality of IC devices comprising a first IC device, a second IC device and a third IC device, the first IC device having a higher power than the second IC, and the second IC device having a higher power than each remaining other IC devices of the plurality of IC devices;
- a heat spreader disposed over the first IC device, the heat spreader having a window;
- a spring biasing the heat spreader against the first IC device and the third IC device;
- and
- a cover disposed over the heat spreader, the cover having a protrusion extending through the window of the heat spreader, the second IC device having a direct heat transfer path to the protrusion.
Dependencies are inferred from the claim text.