Top side cooled semiconductor packages
AssigneeWolfspeed, Inc.
InventorsAdil Salman, Ajay Sekar Chandrasekaran, Kuldeep Saxena
Life of this patent
Estimating the term…
Abstract
Top-side cooled semiconductor packages are disclosed. A top-side cooled semiconductor package may be a leaded or a leadless semiconductor package. A top-side cooled semiconductor package can include built-in electrical isolation for a semiconductor die within a housing of the semiconductor package. A top-side cooled semiconductor package may include one or more arrangements of creepage extension structures. A creepage extension structure may be arranged as part of a top side of a housing, of part of at least one peripheral side of the housing, as part of a bottom side of the housing, or combinations thereof.
Claims40
A top-side cooled semiconductor package comprising:
- a housing;
- a first contact within the housing at a top side of the housing, the first contact included in a thermal transfer path for the top-side cooled semiconductor package;
- a semiconductor die within the housing below the first contact, the semiconductor die comprising a contact pad at a first side of the semiconductor die;
- a second contact within the housing at a bottom side of the housing;
- an electrical connector operably connecting the second contact to the contact pad of the semiconductor die;
- and
- a creepage extension structure that extends into a side of the housing, the creepage extension structure comprising one or more trenches.
A system, comprising:
- a top-side cooled semiconductor package, the top-side cooled semiconductor package comprising a housing having a top side and a bottom side;
- a heat sink operably connected to the top side of the housing;
- and
- a circuit board operably connected to the bottom side of the housing,
- wherein the top-side cooled semiconductor package comprises:
- a first contact within the housing at the top side of the housing, the first contact and the heat sink included in a thermal transfer path for the top-side cooled semiconductor package;
- a semiconductor die within the housing below the first contact, the semiconductor die comprising a contact pad at a first side of the semiconductor die;
- a second contact within the housing at a bottom side of the housing;
- an electrical connector operably connecting the second contact to the contact pad of the semiconductor die;
- and
- a creepage extension structure that extends into at least one side of the housing, the creepage extension structure comprising one or more trenches.
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24-26. (canceled)
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A top-side cooled semiconductor package, comprising:
- a housing;
- a first contact within the housing at a top side of the housing;
- a semiconductor die within the housing below the first contact, the semiconductor die comprising a contact pad at a first side of the semiconductor die;
- a power substrate within the housing between the first contact and a second side of the semiconductor die, the first contact and the power substrate included in a thermal transfer path of the top-side cooled semiconductor package;
- a second contact within the housing at a bottom side of the housing;
- and
- an electrical connector operably connecting the second contact to the contact pad of the semiconductor die.
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36-38. (canceled)
A top-side cooled semiconductor package, comprising:
- a housing;
- a first contact within the housing at a top side of the housing, the first contact included in a thermal transfer path of the top-side cooled semiconductor package;
- a semiconductor die within the housing below the first contact, the semiconductor die comprising a first contact pad at a first side (top) of the semiconductor die that is operably connected to the first contact and a second contact pad at a second side (bottom) of the semiconductor die;
- a second contact within the housing at a bottom side of the housing;
- and
- an electrical connector operably connecting the second contact to the second contact pad of the semiconductor die.
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44-48. (canceled)
Dependencies are inferred from the claim text.