Heat dissipation optimization method of silicon-based SU-8 thin film package

A method for optimizing heat dissipation of silicon-based SU-8 thin film packaging, in which, an embedded packaging method is adopted, a molybdenum copper sheet is arranged on the back of the embedded chip, and wiring interconnection via metal pattern on SU-8 photoresist on the front side of the silicon substrate, and the silicon wafer thinning process on the back side exposes the molybdenum copper sheet from the surface of the silicon substrate and directly contacts the heat sink to achieve heat dissipation optimization;

• the said embedded package method consists:
• etching a deep groove corresponding to the embedded chip on the silicon substrate, metalling the surface of the silicon substrate and the embedded groove cavity surface to build a good grounding and electromagnetic shielding environment;
• and set the semiconductor chip with a molybdenum copper sheet and then embedded in the deep groove etched on the silicon substrate.