Thermal pad structures for led packages with reduced sizes
AssigneeCreeLED, Inc.
InventorsRobert Wilcox, Colin Blakely
Life of this patent
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Abstract
Light-emitting diode (LED) packages and more particularly thermal pad structures for LED packages with reduced sizes are disclosed. LED packages include an LED chip on a submount with an anode mounting pad, a cathode mounting pad, and a thermal pad on an opposite side of the submount to the LED chip. Structures of thermal pads and corresponding anode and cathode mounting pads include arrangements that provide shortest distances values between the thermal pads and the anode and cathode mounting pads that provide increased surface area for heat dissipation while also reducing electrical shorting, particularly for submounts with compact sizes.
Claims21
A light-emitting diode (LED) package comprising:
- a submount comprising a first side and a second side that opposes the first side;
- an LED chip on the first side of the submount;
- an anode mounting pad and a cathode mounting pad on the second side of the submount, the anode mounting pad and the cathode mounting pad being electrically coupled to the LED chip;
- and
- a thermal pad on the second side of the submount, the thermal pad arranged between the anode mounting pad and the cathode mounting pad on the second side such that a shortest distance between the thermal pad and the anode mounting pad or the cathode mounting pad is in a range from 125 microns (μm) to 325 μm.
A light-emitting diode (LED) package comprising:
- a submount comprising a first side and a second side that opposes the first side, the submount comprising a length and a width that are both less than 2 millimeters (mm);
- an LED chip on the first side of the submount;
- an anode mounting pad and a cathode mounting pad on the second side of the submount, the anode mounting pad and the cathode mounting pad being electrically coupled to the LED chip;
- and
- a thermal pad on the second side of the submount such that a shortest distance between the thermal pad and the anode mounting pad is in a range from 125 microns (μm) to 325 μm and a shortest distance between the thermal pad and the cathode mounting pad is in a range from 125 μm to 325 μm.
Dependencies are inferred from the claim text.