Semiconductor module, and manufacturing method for semiconductor module

A manufacturing method for a semiconductor module including:

• a first die pad having a first face, and a second face directed in a direction opposite to the first face,
• a first outer lead positioned in the direction in which the second face is directed relative to the first die pad,
• a first inner lead connecting the first die pad and the first outer lead to each other and having a stepped portion,
• a first semiconductor chip joined to the second face, and
• a sealing material sealing the first die pad and the first semiconductor chip, the method comprising:
• preparing a lead frame including the first die pad, the first outer lead, and the first inner lead;
• forming, as a first forming step, a first sealing portion to be joined to the first face as a part of the sealing material using a first resin composition;
• and
• forming, as a second forming step, forming a second sealing portion to be joined to the second face as another part of the sealing material using a second resin composition lower in thermal conductivity than the first resin composition,
• wherein the first sealing portion has:
• an exposed face constituting a part of an outer surface of the sealing material;
• a first joining face joined to the first die pad;
• and
• a second joining face joined to the stepped portion along a height direction of the stepped portion.