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US 2023/0420319 A1Published application
Semiconductor package encapsulant with metal activated inorganic filler particles
AssigneeInfineon Technologies AG
InventorsQun YE, Stefan SCHWAB
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Abstract
A semiconductor package encapsulant is enclosed. In one example, the semiconductor package encapsulant is for at least partially encapsulating a semiconductor component, wherein the semiconductor package encapsulant comprises metal activated inorganic filler particles providing a corrosion protection function.
Claims20
A semiconductor package encapsulant for at least partially encapsulating a semiconductor component, wherein the semiconductor package encapsulant comprises metal activated inorganic filler particles providing a corrosion protection function.
A method comprising:
- providing a semiconductor package encapsulate;
- at least partially encapsulating a semiconductor component using the semiconductor package encapsulant;
- and
- metal activated inorganic filler particles in the semiconductor package encapsulant for providing a corrosion protection function in a semiconductor package.
1 more element
Dependencies are inferred from the claim text.