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US 2023/0420318 A1Published application
Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorAkira MOROZUMI
Life of this patent
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Abstract
A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.
Claims15
A semiconductor module comprising:
- a mounting substrate including a mounting surface;
- a semiconductor element disposed on the mounting surface;
- a housing for the semiconductor element;
- a lid fixed to the housing and facing the mounting surface;
- an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element;
- and
- a first adsorbent that is disposed between the lid and the insulating sealing material and is swollen by adsorption.
4 more elements
Dependencies are inferred from the claim text.