Integrated Electronic Component
AssigneeNippon Telegraph and Telephone Corporation
InventorTadashi Minotani
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Abstract
An integrated electronic component includes a lower chip having electrode pads, a molded resin, a rewiring layer, and an upper chip having electrode pads. The rewiring layer has electrode pads that are formed on the lower surface of an insulator and are connected to the electrode pads, electrode pads that are formed on the upper surface of the insulator and are connected to the electrode pads, and interlayer connection conductors that are formed in the insulator and connect the electrode pads and the electrode pads. The electrode pads and the electrode pads are disposed to face each other.
Claims6
An integrated electronic component comprising:
- a first chip having a first electrode pad disposed on a surface thereof;
- a rewiring layer disposed on the surface of the first chip where the first electrode paid is disposed;
- and
- a second chip disposed on the rewiring layer and having a second electrode pad on a surface facing the rewiring layer,
- wherein
- the rewiring layer includes:
- an insulator layer;
- a third electrode pad disposed on a first surface of the insulator layer facing the first chip, the third electrode pad connected to the first electrode pad;
- a fourth electrode pad disposed on a second surface of the insulator layer facing the second chip, the fourth electrode pad connected to the second electrode pad;
- and
- an interlayer connection conductor formed in the insulator layer, the interlayer connection conductor connecting the third electrode pad and the fourth electrode pad to each other,
- wherein
- the third electrode pad and the fourth electrode pad are disposed at corresponding positions on the first surface and the second surface of the insulator layer, respectively.
Dependencies are inferred from the claim text.