Base plate having sidewall, power semiconductor module comprising the base plate and method for producing the base plate

A power semiconductor module comprising:

• a base plate comprising:
• a basic body formed in one piece, the basic body has a front side and a rear side, the front side comprising a mounting area of the base plate, along at least one of its edges, the basic body has at least one elevated integral part forming at least one sidewall projecting beyond the mounting area by a vertical height, at regions of the mounting area, the basic body has a vertical thickness extending between the front side and the rear side, the vertical thickness being larger than the vertical height of the sidewall, and
• wherein along all edges, the basic body comprises either at least one sidewall or at least one groove but not both sidewall and groove at the same edge, wherein along at least one of its edges, the basic body comprises one elevated integral part forming the at least one sidewall;
• and
• a housing body, wherein the housing body laterally surrounds the base plate, and wherein the sidewall is covered by the housing body and the at least one groove is at least partially filled by a material of the housing body so that both the sidewall and the groove serve as anchoring structures which additionally fix the housing body to the base plate.