Implanting system for fabricating semiconductor device structure

An implanting system for fabricating a semiconductor device structure, comprising:

• an etch module configured to execute a first implanting recipe on a first wafer to turn a first wafer state of the first wafer to a second wafer state;
• a first measurement module configured to collect the second wafer state of the first wafer to generate a first set of data;
• and
• an artificial intelligence module coupled to the first measurement module and the etch module, configured to analyze the first set of data and update the first implanting recipe to generate a second implanting recipe when the first set of data is not within a predetermined range;
• wherein the second implanting recipe is configured to be applied on a second wafer to be processed after the first wafer;
• wherein the artificial intelligence module is configured for generating the second implanting recipe taking into consideration at least one of an implanting rate of the second wafer, a rate of rotation of the second wafer, a tilt angle of the second wafer, an etching recipe of the first wafer, and a deposition recipe of the first wafer.