Wafer placement table

A wafer placement table comprising:

• a ceramic substrate that has a wafer placement surface on an upper surface thereof and that includes an electrode therein;
• a first cooling substrate formed of a composite material of metal and ceramic or a low thermal expansion metal material;
• a metal joining layer that joins a lower surface of the ceramic substrate and an upper surface of the first cooling substrate to each other;
• a second cooling substrate in which a refrigerant flow path is formed;
• a heat dissipation sheet disposed between a lower surface of the first cooling substrate and an upper surface of the second cooling substrate;
• at least one screw hole that opens in the lower surface of the first cooling substrate;
• a through hole that is provided at a position facing the at least one screw hole and that extends through the second cooling substrate in an up-down direction;
• and
• a screw member that is inserted into the through hole from a lower surface of the second cooling substrate and that is screwed into the at least one screw hole.