Radiatively-Cooled Substrate Holder
AssigneeTel Manufacturing and Engineering of America, Inc.
InventorKevin Siefering
Life of this patent
Estimating the term…
Abstract
A method of cooling a substrate during processing includes processing a substrate supported by a substrate holder where the substrate is heated by the processing, cooling the substrate while processing the substrate by radiating heat from the substrate holder, and maintaining the substrate at a steady temperature to within a tolerance while processing the substrate. The substrate is maintained at the steady temperature by heating the substrate holder such that heat transferred from the substrate by radiating heat from the substrate holder substantially balances heat transferred to the substrate by processing the substrate and by heating the substrate holder.
Claims20
A method of cooling a substrate during processing, the method comprising:
- processing a substrate supported by a substrate holder, the substrate being heated by the processing;
- cooling the substrate while processing the substrate by radiating heat from the substrate holder;
- and
- maintaining the substrate at a steady temperature to within a tolerance while processing the substrate by heating the substrate holder such that heat transferred from the substrate by radiating heat from the substrate holder substantially balances heat transferred to the substrate by processing the substrate and by heating the substrate holder.
A substrate holder comprising:
- a chuck configured to immobilize a substrate at a first side of the chuck comprising a first material;
- a heater disposed on or in the chuck and configured to heat the substrate;
- and
- a second material disposed at a second side of the chuck opposing the first side, the second material comprising an exposed surface configured to cool the substrate by emitting thermal radiation, the emissivity of the first material being lower than the emissivity of the second material.
A substrate processing apparatus comprising:
- a vacuum chamber;
- an electrostatic chuck (ESC) disposed in the vacuum chamber and having no liquid cooling mechanism, the ESC being configured to clamp a substrate to an upper surface of the ESC facing a localized processing source;
- a heater integrated with the ESC and configured to heat the substrate while processing the substrate;
- and
- a mechanical arm attached to the ESC and configured to move the substrate laterally relative to the localized processing source to process the substrate.
Dependencies are inferred from the claim text.