Manufacture of a hybrid contactless chip card with smds and embedded nfc antenna

Abstract

A method for manufacturing a contactless chip card that makes provision to obtain a voltage-rectifying-circuit-forming printed-circuit module incorporating one or more SMDs forming a full-wave bridge rectifier, to place this module in a punch provided in a conventional chip-card substrate, then, to form an NFC wire radiofrequency antenna by embedding a conductive wire in the bulk of the substrate, the ends of which are soldered to input terminals of the module. Other electronic modules operating on DC currents are then easily integrated into the card, electrical links with the rectifier module also being produced by embedding an electrical wire in the bulk of the substrate. The disclosure advantageously allows the combination of low cost embedding of a conductive wire by ultrasound to form a radiofrequency antenna and the flexibility of use of SMDs.

Dependencies are inferred from the claim text.