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US 2023/0418776 A1Published application
Bus protocol for multiple chipsets
AssigneeApple Inc.
InventorsFarouk Belghoul, Paul V. Flynn, Tideya Kella, Vijay Kumar Ramamurthi
Life of this patent
Estimating the term…
Abstract
Circuits, methods, and apparatus that can allow chipsets in an electronic device to share information such that they can more efficiently utilize resources that are available in the electronic device. One example can provide a bus that is shared by three or more chipsets in an electronic device. This shared bus can be used by the chipsets in the electronic device to communicate and negotiate for the utilization of resources of the electronic device.
Claims20
An electronic device comprising:
- a first chipset for wireless communication;
- a second chipset;
- and
- an inter-chipset bus coupled to the first chipset, coupled to the second chipset, and configured to transfer one or more messages between the first chipset and the second chipset to negotiate for use of one or more resources shared by the first chipset and the second chipset.
1 more element
An electronic device comprising:
- a chipset for wireless communication;
- and
- an inter-chipset bus coupled to the chipset, wherein the chipset includes an auto-response buffer configured to be powered on and accessible via the inter-chipset bus when the chipset is powered down or in a sleep state.
An electronic device comprising:
- a first chipset for wireless communication;
- a second chipset for wireless communication;
- a third chipset;
- and
- a shared bus coupled to the first chipset, coupled to the second chipset, coupled to the third chipset, and configured to transfer messages between the first chipset and the second chipset, transfer messages between the first chipset and the third chipset, and transfer messages between the second chipset and the third chipset.
2 more elements
Dependencies are inferred from the claim text.