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US 2023/0418508 A1Published application
Performing distributed processing using distributed memory
AssigneeIntel Corporation
InventorsAbhishek Anil Sharma, Pushkar Ranade, Sagar Suthram, Wilfred Gomes, Rajabali Koduri
Life of this patent
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Abstract
In one embodiment, an apparatus comprises: a plurality of banks to store data; and a plurality of interconnects, each of the plurality of interconnects to couple a pair of the plurality of banks. In response to a data movement command, a first bank of the plurality of banks is to send data directly to a second bank of the plurality of banks via a first interconnect of the plurality of interconnects. Other embodiments are described and claimed.
Claims20
An apparatus comprising:
- a plurality of banks to store data;
- and
- a plurality of interconnects, each of the plurality of interconnects to couple a pair of the plurality of banks, wherein a first bank of the plurality of banks is to send data directly to a second bank of the plurality of banks via a first interconnect of the plurality of interconnects.
A method comprising:
- receiving, in a distributed memory controller of a memory, a scatter instruction, the memory comprising a plurality of banks to store data and a plurality of interconnects, each of the plurality of interconnects to couple a pair of the plurality of banks;
- in response to the scatter instruction, storing a plurality of data blocks in at least some of the plurality of banks;
- and
- communicating first data stored in a first bank to a second bank via a first interconnect of the plurality of interconnects.
1 more element
A package comprising:
- a first die comprising a memory having a plurality of banks to store data and a plurality of interconnects to directly couple corresponding pairs of the plurality of banks, wherein the pairs of the plurality of banks are to directly communicate data therebetween according to a message passing interface protocol;
- and
- a second die comprising a plurality of execution circuits, wherein the first die is coupled to the second die in a stacked arrangement.
Dependencies are inferred from the claim text.