Edge exposure apparatus, method of making and using the same
OwnerMerritt Connerinventor
Life of this patent
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Abstract
An LED wafer edge exposure apparatus may be used to emit light on a workpiece (such as a silicon wafer with a photoresist layer) during a manufacturing process (such as an edge exposure process or photolithography process) of semiconductors (such as computer chips). The LED wafer edge exposure apparatus may be created by exchanging an existing light source, e.g., a mercury vapor lamp, with a replacement light source, e.g., an LED light source in a high energy wafer edge exposure apparatus.
Claims10
A method for retrofitting an existing high energy edge exposure unit, comprising:
- removing an existing high energy light source from the existing high energy edge exposure unit;
- and
- arranging a low energy light source in the existing high energy edge exposure unit.
A method of operating a retrofit high energy edge exposure unit for edge exposure, comprising:
- proving a low energy retrofit edge exposure unit;
- receiving a workpiece covered by a photosensitive layer;
- and
- exposing an edge portion of the photosensitive layer to radiation generated by the low energy retrofit edge exposure unit.
An edge-exposure tool, comprising:
- a workpiece table configured to support a workpiece covered by a photosensitive layer, and
- a retrofit edge exposure light source configured to radiate the photosensitive layer.
-40. (canceled)
Dependencies are inferred from the claim text.