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US 2023/0418136 A1Published application
Cooling device and electronic apparatus system
AssigneeFUJIFILM Corporation
InventorsYuta WATANABE, Yoshihiro HAYASHI, Nobuaki SUZUKI, Kouhei AWAZU
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Abstract
There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.
Claims14
A cooling device comprising:
- a heat sink on which a plurality of fins for heat radiation are formed;
- and
- an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins,
- wherein the attachment mechanism includes an insertion hole provided in the formation region, and
- the insertion hole is provided between two fins adjacent to each other.
2 more elements
Dependencies are inferred from the claim text.